To provide a resin-inorganic composite which is widely applied to a light-emitting component, an electronic component and a machine component, and to provide a manufacturing method therefor.
It is clear from the figure that a thick film of the resin-inorganic composite is formed of inorganic particles bonded with each other through the resin. The average diameter of the inorganic particles shown by white parts in the figure is 1.85 μm. It means that the average particle diameter of a starting alumina material is not significantly different from the average particle diameter of the alumina particles in the resin-inorganic composite, and consequently means that the inorganic particles are not deformed and/or broken in a collision process. A dark part in the figure is a pore or a part filled with the resin.
ABE HIROYA
NAITO MAKIO
