Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
樹脂成形品の製造方法及び樹脂成形装置
Document Type and Number:
Japanese Patent JP7240339
Kind Code:
B2
Abstract:
Provided is a method for manufacturing a resin molded product capable of improving the positioning accuracy of a lead frame. The method includes: a carrying-in process of holding a support member for supporting the lead frame and carrying the support member into a molding die; and a resin molding process of resin molding with respect to the lead frame. In the carrying-in process, the support member is removed from the lead frame, and the position of the lead frame is determined with respect to the molding die.

More Like This:
JP2014216607SEALING SHEET STICKING METHOD AND SEALING SHEET STICKING DEVICE
JP2002217523METHOD OF MANUFACTURING ELECTRONIC DEVICE
JPH07297324SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Inventors:
Tetsuo Ota
Nobuyuki Morohashi
Application Number:
JP2020006547A
Publication Date:
March 15, 2023
Filing Date:
January 20, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
towa corporation
International Classes:
H01L21/56; B29C33/34
Domestic Patent References:
JP2018125356A
JP2007242958A
JP5021486A
JP5021440U
JP2008028189A
Attorney, Agent or Firm:
Toyohiko Nagata
Hidefumi Takagi



 
Previous Patent: A prosthetic heart valve with three leaflet designs for use in percutaneous valve replacement proced...

Next Patent: PASTE FOR INTERNAL ELECTRODE OF LAMINATED CERAMIC CAPACITOR