To provide a method for manufacturing a sapphire substrate with surface roughness in the same level of that of a sapphire substrate surface which has been obtained by chemical mechanical polishing (CMP) even if processing cost is reduced, and to provide a sapphire substrate.

The method for manufacturing the sapphire substrate in which a substrate obtained by slicing a sapphire ingot is subjected to processing including a plurality of steps to manufacture a sapphire substrate includes: a wet blasting step where at least a principal surface 10A of the substrate 10 is subjected to wet blast; and a CMP step where the wet-blasted principal surface 10A is subjected to CMP after the wet blasting step.