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Title:
METHOD OF MANUFACTURING SEMICONDUCTIVE SEAMLESS BELT
Document Type and Number:
Japanese Patent JP2012093575
Kind Code:
A
Abstract:

To provide a method of manufacturing a semiconductive seamless belt which is free of breakage, cracking, etc., of the belt due to warpage of both ends of the belt and also free of inter-layer peeling between an outer layer and an inner layer by improving the warpage of both ends of the belt for use as a functional belt of an image forming apparatus, and with which a sharp image is obtained.

The method of manufacturing the belt comprising the outer layer and inner layer consisting principally of polyimide-based resin includes the steps of: forming an outer layer coating using a polyamic acid solution; forming an inner layer coating using a polyamic acid solution; adjusting solvent vaporization rates of the whole outer layer coating and inner layer coating to 75 wt.% or higher; and forming the outer layer and inner layer through imide conversion of the outer layer coating and inner layer coating. The polyamic acid solution used for the outer layer coating has a higher solid content concentration than the polyamic acid solution used for the inner layer coating, and the outer layer and inner layer contain conductive substances.


Inventors:
WATANABE YOSHINOBU
Application Number:
JP2010241211A
Publication Date:
May 17, 2012
Filing Date:
October 27, 2010
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
G03G15/16; B29D29/00
Domestic Patent References:
JP2004029769A2004-01-29
JP2004012951A2004-01-15
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office