To achieve a process for polishing a wafer extremely thin after forming a circuit therein, dicing the wafer into individual chips and bonding the chip to a support through a die attach film without causing any warp or damage of the wafer.

The process for assembling a semiconductor apparatus comprises a step for sticking a die attach film to the back of a wafer diced into individual chips by half cut dicing, a step for cutting the die attach film into chip size by dicing it in accordance with a street, a step for thermocompressing the chip with the die attach film against a support through an adhesive tape (A) while positioning, and a step for stripping the adhesive tape (A) from the chip bonded through the die attach film.