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Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT AND PLASMA CLEANING DEVICE
Document Type and Number:
Japanese Patent JP3462850
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor component, capable of plasma cleaning a large quantity of semiconductor chips at one time and using a long-sized lead frame wound on a reel, by unwinding the frame from the reel with the frame not being subjected to plasma treatment.
SOLUTION: The method for manufacturing the semiconductor component comprises the step of plasma cleaning a wafer ring 301, in a state in which a semiconductor chip 203 cut out from a wafer 201 or the wafer 201 before cut out to semiconductor chips 203 is fixed to a wafer sheet 302.


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Inventors:
Masayuki Fukuda
Application Number:
JP2000390147A
Publication Date:
November 05, 2003
Filing Date:
December 22, 2000
Export Citation:
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Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
B08B7/00; H01L21/302; H01L21/304; H01L21/3065; H01L21/60; (IPC1-7): H01L21/304; H01L21/3065
Domestic Patent References:
JP200091285A
JP2000174057A
Attorney, Agent or Firm:
Shizuo Sano



 
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