Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND CHEMICALS
Document Type and Number:
Japanese Patent JP2017076817
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To inhibit pattern collapse in dehydration after a liquid treatment.SOLUTION: The method for manufacturing the semiconductor device comprises: a process of adhering a first liquid to a surface of a semiconductor substrate; and a process of replacing the first liquid by a solution where a precipitate is dissolved in a second liquid. The method further comprises a process of vaporizing the second liquid to deposit the precipitate on the surface of the semiconductor substrate; and a process of removing the precipitate by decompressing and/or heating the precipitate and by changing the precipitate from solid to gas.SELECTED DRAWING: Figure 3
Inventors:
IGARASHI JUNICHI
SATO KATSUHIRO
HIRAKAWA MASAAKI
SATO KATSUHIRO
HIRAKAWA MASAAKI
Application Number:
JP2017000596A
Publication Date:
April 20, 2017
Filing Date:
January 05, 2017
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/304; C07C61/09; H01L21/8242; H01L27/108
Domestic Patent References:
| JP2013042093A | 2013-02-28 | |||
| JP2013016699A | 2013-01-24 | |||
| JP2008010638A | 2008-01-17 | |||
| JPH09190996A | 1997-07-22 |
Attorney, Agent or Firm:
Patent Business Corporation Sato International Patent Office