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Patent Searching and Data


Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2011003667
Kind Code:
A
Abstract:

To provide a method of manufacturing a semiconductor device, which can be effectively inspected even in a transfer process and a thin-film processing process.

The method of manufacturing the semiconductor device includes a step of sticking a first substrate (S1), where an element layer (17) having an element (T) and an external connection terminal (P) connected to the element is formed, to a second substrate (S2) through an adhesive layer (21), wherein at least a portion of a flexible printed circuit (50) is inserted between the first substrate and second substrate in the step so as to electrically connect to the external connection terminal. In this method, the element can be easily inspected using the flexible printed circuit.


Inventors:
KANEDA KOJI
Application Number:
JP2009000144540
Publication Date:
January 06, 2011
Filing Date:
June 17, 2009
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H01L21/02; G02F1/1345; H01L27/12
Attorney, Agent or Firm:
稲葉 良幸
田中 克郎