METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Title:

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2002334976

Kind Code:

A

Abstract:

To provide a method for manufacturing a semiconductor device, capable of improving a stage tact without causing defects or malfunctions.

An aperture 12, capable of transmitting a light, is formed on a wiring board 11, pads 13 are formed on the ends of the aperture 12 side on the wiring board 11, and bumps 14 are formed on the pads 13, while a light- receiving part 16 for applying light is disposed on a solid-state imaging element 15, pads 17 are formed on the surface side of the element 15 where the part 16 is provided, the element 15 is disposed, so that the part 16 may face the aperture 12 of the wiring board 11. The pads 17 of the element 15 are jointed to the pads 13 of the wiring board 11 via the bumps 14. Thus, the step of forming the bumps 14 on the pads 17 of the element 15 is eliminated.

Inventors:

KASHIWAZAKI ATSUSHI

Application Number:

JP2001139524A

Publication Date:

November 22, 2002

Filing Date:

May 10, 2001

Export Citation:

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Assignee:

SONY CORP

International Classes:

H01L27/14; H01L21/60; H01L31/02; (IPC1-7): H01L27/14; H01L21/60; H01L31/02

Attorney, Agent or Firm:

Kashima Hidemi

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