To reduce the inventory of a semiconductor device having a prescribed characteristic by efficiently manufacturing the device.

In the manufacturing process of the semiconductor device by assembling two chips into one package, one chips to be assembled (semiconductor light emitting chips) are ranked in units of wafers or lots on the basis of a prescribed characteristic value A by using the information on wafer tests performed on the chips. In addition, the other chips (semiconductor light receiving chips) to be assembled are ranked in units of wafers or lots on the basis of another prescribed characteristic value B by using the information on the wafer tests performed on the chips. Finally, the prescribed characteristic value C of the semiconductor device is obtained by assembling the chips (semiconductor light emitting chips) of a specific rank and the other chips (semiconductor light emitting chips) of another specific rank in units of wafers or lots.