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Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2011068974
Kind Code:
A
Abstract:

To enhance the quality of a film by suppressing the incorporation of impurities into the thin film.

A method for manufacturing a semiconductor device includes the steps of: supplying a halogen-containing gas into a treatment chamber for treating a substrate therein; supplying a source gas which is different from the halogen-containing gas into the treatment chamber; producing active species of the source gas in the vicinity of the substrate by supplying an electron-beam into the treatment chamber; forming a thin film on the substrate by making the active species of the source gas react with the halogen-containing gas; supplying a hydrogen-containing gas into the treatment chamber; producing active species of the hydrogen-containing gas in the vicinity of the substrate by supplying an electron-beam into the treatment chamber; and reforming the thin film which has been formed on the substrate by making the active species of the hydrogen-containing gas react with halogen elements in the thin film which has been formed on the substrate.


Inventors:
HIRAMATSU HIROO
YAMAGUCHI TENWA
SHIRAKO KENJI
Application Number:
JP2009222920A
Publication Date:
April 07, 2011
Filing Date:
September 28, 2009
Export Citation:
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Assignee:
HITACHI INT ELECTRIC INC
International Classes:
C23C16/44; C23C16/56; H01L21/205; H01L21/28; H01L21/285; H01L21/31
Attorney, Agent or Firm:
Toru Yui
Aniya Setsuo
Hitoshi Kiyono
Fukuoka Masahiro