Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2015053468
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package capable of forming an intended circuit element with a high yield, after a sealant using a sealing resin sheet, is ground.SOLUTION: A method for manufacturing a semiconductor package comprises: a sealant formation step for forming a sealant in which one or a plurality of semiconductor chips are embedded in a sealing resin sheet; and a grinding step for grinding the sealing resin sheet of the sealant so that a surface on the opposite side of an active surface of the semiconductor chip is exposed, to form a ground body. A maximum difference of elevation between the surface of the sealing resin sheet on the ground body and an exposed surface of the semiconductor chip is equal to or less than 10 μm.
Inventors:
MORITA KOSUKE
ISHIZAKA TAKESHI
TOYODA HIDESHI
SHIGA GOSHI
IINO CHIE
ISHIZAKA TAKESHI
TOYODA HIDESHI
SHIGA GOSHI
IINO CHIE
Application Number:
JP2014126120A
Publication Date:
March 19, 2015
Filing Date:
June 19, 2014
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H01L21/304; B24B7/10; H01L21/301; H01L21/56; H01L23/12; H01L23/28
Attorney, Agent or Firm:
Patent business corporation ユニアス international patent firm
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