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Title:
はんだ接合部の製造方法
Document Type and Number:
Japanese Patent JP7291320
Kind Code:
B2
Abstract:
To provide a production method pf a solder joint where the highly reliable joint suppressed with volumetric change associated with phase transformation during operation even when performing plurality times of melting, cooling and solidification of a solder alloy, the occurrence of strains and cracks caused by the volumetric change and the like can be formed with superior productivity.SOLUTION: In a production method of a solder joint, a cooling step is repeated plurality times, in which an alloy containing 0.3-7.6 wt.% of Cu and the balance Sn with inevitable impurities is heated to 186°C or higher and cooled to 186°C or lower. In each cooling step, the alloy is heated to 186°C or higher and cooled so that a cooling temperature line showing the secular change of the alloy passes a mixture region of a stable orthorhombic crystal and a hexagonal crystal of Cu6Sn5 and a holding time in the temperature range of 160-137°C becomes 96-305 s.SELECTED DRAWING: None

Inventors:
Tetsuro Nishimura
Takatoshi Nishimura
Kazuhiro Nokita
Stewart David McDonald
Flora Somidin
Xiao Zhou Ye
Application Number:
JP2018201476A
Publication Date:
June 15, 2023
Filing Date:
October 26, 2018
Export Citation:
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Assignee:
Nippon Superior Co., Ltd.
International Classes:
B23K31/02; B23K1/00; B23K35/26; C22C13/00
Domestic Patent References:
JP2005150655A
Foreign References:
WO2013002112A1
WO2009051181A1
WO2009051255A1
WO2018096917A1
Attorney, Agent or Firm:
Takao Yagino
Yoshihide Yanagino
Norio Morioka
Hisayoshi Sekiguchi
Masato Nakagawa