Title:
METHOD OF MANUFACTURING SOLID MATERIAL WOOD GRAIN SHEET SUBSTRATE
Document Type and Number:
Japanese Patent JP2022138888
Kind Code:
A
Abstract:
To provide a method of manufacturing a solid material wood grain sheet substrate.SOLUTION: Wide width plate areas 2A on both upper and lower sides of a waste part 21 and narrow width plate areas 2B on both right and left sides of the waste part 21 are partitioned, the waste part 21 at a center of an annual ring cross-section of a thin and long trunk 2 laterally placed in a horizontal direction to perform cutting layer by layer in the horizontal direction by being set to the same thickness thereof. Narrow materials 2C on both top and bottom sides of the wide width plate areas 2A are eliminated after acquiring a multi-layer plate body. Multi-layered wide width main boards 22 are cut out after eliminating surplus sides 2D on both right and left sides. According to the narrow width plate areas 2B at a middle stage, the waste part 21 is eliminated in a vertical direction by cutting. Multi-layered wide width side materials are cut out after eliminating the surplus sides 2D on both the right and left sides. A plurality of the multi-layered wide width main boards 22 each having the same length are selected, and the side materials constitute a substrate 3 via bonding in a horizontal direction, according to overall demand of a width. A film plate 4 capable of being processed by moving a whole body is constituted after sealing the sides by bonding a square bar whose both sides in a length direction of the substrate 3 have the same thickness. The film plate 4 is thinly sliced in a horizontal direction. A sheet 41 for expressing connection of natural grains is prepared.SELECTED DRAWING: Figure 4
Inventors:
HUANG YU-ZHE
Application Number:
JP2021039012A
Publication Date:
September 26, 2022
Filing Date:
March 11, 2021
Export Citation:
Assignee:
TAIMAN WOOD BUILDING MAT CO LTD
International Classes:
B27D1/04
Attorney, Agent or Firm:
Takahiro Ozaki