METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

Title:

METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

Document Type and Number:

Japanese Patent JP2016027660

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a method that can enhance the yield while maintaining the optical characteristic of a solid-state image pickup device having a shading film.SOLUTION: A method of manufacturing a solid-state image pickup device having a pixel part and a peripheral circuit part comprises: a step of forming a first insulation film on the pixel part and the peripheral circuit part; a step of forming a second insulation film on the first insulation film; and a step of etching the second insulation film of a photoelectric conversion part. The method of manufacturing the solid-state image pickup device further comprises a step of forming a metal film on the etched second insulation film of the photoelectric conversion part and the second insulation film of the peripheral circuit part, and a step of removing the metal film of the peripheral circuit part and forming a shading film from the metal film in the photoelectric conversion part.SELECTED DRAWING: Figure 1

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Inventors:

HASHIMOTO KOHEI
ITABASHI MASAJI

Application Number:

JP2015184488A

Publication Date:

February 18, 2016

Filing Date:

September 17, 2015

Export Citation:

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Assignee:

CANON KK

International Classes:

H01L27/14; H01L27/146

Domestic Patent References:

JP2012248681A	2012-12-13
JP2008041726A	2008-02-21
JPH0529598A	1993-02-05
JP2010206095A	2010-09-16
JP2009105358A	2009-05-14

Attorney, Agent or Firm:

Takuma Abe
Sogo Kuroiwa

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