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Title:
METHOD OF MANUFACTURING SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING ELEMENT
Document Type and Number:
Japanese Patent JP2011003670
Kind Code:
A
Abstract:

To manufacture a solid-state imaging element capable of suppressing the damage of a microlens material layer or the like due to hydrophilization treatment.

The method of manufacturing the solid-state imaging element includes a process of forming a light receiving part in the light receiving region 11 of a semiconductor substrate, a process of forming a pad part 24 in the pad region 12 of the semiconductor substrate, a process of forming the microlens material layer 22 on the upper layer of the light receiving part and the pad part 24, a process of forming a microlens corresponding to the light receiving part in the microlens material layer 22, a process of forming a low reflection material layer 23 on the microlens material layer 22, a process of etching the microlens material layer 22 and the low reflection material layer 23 on the pad part 24 and forming an opening 25, and a process of hydrophilizing the surface of the low reflection material layer 23 and the inside of the opening 25 by normal temperature oxygen radical treatment.


Inventors:
Togu, Akihiro
Hori, Ina
Dofuku, Tadayuki
Kamiie, Hitomi
Yamamoto, Atsushi
Natori, Taichi
Application Number:
JP2009000144572
Publication Date:
January 06, 2011
Filing Date:
June 17, 2009
Export Citation:
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Assignee:
SONY CORP
International Classes:
H01L27/14; H04N5/335
Domestic Patent References:
JP2005203679A2005-07-28
JPH05335412A1993-12-17
JP2007194307A2007-08-02
JP2003332310A2003-11-21
JP2009099804A2009-05-07
JP2008101110A2008-05-01
JPH04275459A1992-10-01
Attorney, Agent or Firm:
特許業務法人信友国際特許事務所