Title:
溶剤可溶性ポリイミド樹脂の製造方法
Document Type and Number:
Japanese Patent JP6858111
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a solvent-soluble polyimide resin capable of forming an adhesive layer which prevents occurrence of a volatile component formed of a cyclic siloxane compound, and prevents lowering of an adhesive force between a wiring layer and a cover lay film even in use environment exposed to repeated high temperature.SOLUTION: A method for producing a solvent-soluble polyimide resin includes reacting a diamine component containing 50 mol% or more of aliphatic diamine derived from a dimer acid and a tetracarboxylic acid anhydride component in an organic solvent. It is preferable to contain a benzophenone tetracarboxylic acid dianhydride as the tetracarboxylic acid anhydride component. It is preferable that the organic solvent contains at least one selected from the group consisting of N,N-dimethylformaldehyde, N,N-dimethyl acetamide (DMAc), N-methyl-2-pyrrolidone, 2-butanone, dimethyl sulfoxide, dimethyl sulfate, cyclohexanone, dioxane, tetrahydrofurane, diglyme and triglyme.SELECTED DRAWING: None
Inventors:
Tetsuya Nakanishi
Ryo Mori
Yoshiki Sudo
Ryo Mori
Yoshiki Sudo
Application Number:
JP2017204564A
Publication Date:
April 14, 2021
Filing Date:
October 23, 2017
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
C08G73/10; C09J11/06; C09J179/08; H05K1/03
Domestic Patent References:
| JP2013001730A | ||||
| JP2015180750A | ||||
| JP2010006983A | ||||
| JP2010163489A | ||||
| JP2012180471A |
Attorney, Agent or Firm:
Kazuhiro Watanabe