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Title:
METHOD FOR MANUFACTURING STRUCTURAL BODY
Document Type and Number:
Japanese Patent JP2007038245
Kind Code:
A
Abstract:

To provide a method for manufacturing a structural body, which method can efficiently form adhesive sumps for storing excessive adhesive.

The method for manufacturing the structural body X comprises: a first step for forming locating holes 12, 22 for inserting a locating pin 26 into a first base plate 10 and a second base plate 20 respectively; a second step for forming the adhesive sumps composed of a stepped portion 18 by irradiating a plurality of locating pin contact portions 52 in the locating holes 12, 22 formed in the first base plate 10 and/or the second base plate 20 by the laser beam L tracing the scanning locus passing all of locating pin contact portions 52; and a third step for joining the first base plate 10 and the second base plate 20 via the adhesive 24 by inserting the locating pin 26 into the locating holes 12, 22 formed in the first base plate 10 and the second base plate 20 respectively.


Inventors:
YAMAZAKI YUTAKA
UMETSU KAZUNARI
Application Number:
JP2005224014A
Publication Date:
February 15, 2007
Filing Date:
August 02, 2005
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B23K26/382; B23K26/40; B41J2/14; B41J2/145; B41J2/16; B81C3/00
Domestic Patent References:
JP2006297606A2006-11-02
JP4288673B22009-07-01
JPH08174825A1996-07-09
JP2001071512A2001-03-21
JPH11320156A1999-11-24
JP2003022585A2003-01-24
JPH09191168A1997-07-22
JP2005518679A2005-06-23
Foreign References:
WO2003071591A12003-08-28
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama