Title:
METHOD FOR MANUFACTURING STRUCTURE WITH HIGH ASPECT RATIO AND METHOD FOR MANUFACTURING ULTRASONIC PROBE
Document Type and Number:
Japanese Patent JP2017032476
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a structure with a high aspect ratio having a side face perpendicular to a major surface of a substrate by wet etching, and a method for manufacturing an ultrasonic probe.SOLUTION: The method for manufacturing a structure with a high aspect ratio includes: a hole forming step of forming a plurality of holes on one major surface of a substrate 13a; a resist forming step of, after finishing the hole forming step, forming a first region where a resist layer is laid and a second region where the resist layer is not laid on the major surface where the plurality of holes is formed; and a recess forming step of immersing the substrate 13a in an etching solution 16 that can dissolve the substrate 13a to form a recess 134 in the substrate 13a in a portion corresponding to the second region.SELECTED DRAWING: Figure 10
Inventors:
YOKOYAMA HIKARI
Application Number:
JP2015154918A
Publication Date:
February 09, 2017
Filing Date:
August 05, 2015
Export Citation:
Assignee:
KONICA MINOLTA INC
International Classes:
G01T7/00; B82Y20/00; B82Y30/00; C25D11/18; C25D11/24; C25D11/26; C25D11/32; G01N23/20; G21K1/00; G21K1/06; H01L21/3063; H04R31/00
Domestic Patent References:
| JP2001194462A | 2001-07-19 | |||
| JP2013057102A | 2013-03-28 | |||
| JP2010285662A | 2010-12-24 | |||
| JP2011172914A | 2011-09-08 | |||
| JPH11187492A | 1999-07-09 |
Foreign References:
| US5277769A | 1994-01-11 |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Satoshi Sakurai
Masataka Otani
Satoshi Sakurai
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