To provide a method for manufacturing a substrate, preventing breakdowns due to the static electricity of the substrate to be manufactured.

One embodiment of the method for manufacturing substrate for electronic device is a manufacture of a substrate, having a plurality of switching elements and a plurality of wiring lines (120 and 130) electrically connected to the plurality of switching elements, and the method includes a short-circuiting step of forming short-circuit wiring lines (150 and 160) on a substrate (100) to make the plurality of wiring lines (120 and 130) short-circuit; and a short-circuit canceling step of forming openings or notches (210, 220, 230 and 240) on the substrate (100), the openings or notches capable of canceling the short-circuit, by removing at least a portion of the short-circuit wiring lines (150 and 160) from the substrate (100).