To provide a method of manufacturing a substrate sheet with conductive bump, enabling continuous use of a screen plate for a long term and easy transferring of conductive paste while the screen plate and a substrate are slightly separated from each other.
The method of manufacturing the substrate sheet with conductive bump includes: a substrate retention process of retaining such a flat member 62 that a flat recessed part 62b is formed on the center of each flat buildup part 62a and the substrate 60 including such a substrate sheet 61 placed on the flat member 62 that a substrate recessed part 61b is formed on the center of each substrate buildup part 61a; a positioning process of positioning the screen plate 27 having a plurality of through-holes 27a on the substrate 60; and a substrate transferring process of transferring the conductive paste 70 from the through-holes of the screen plate 27 to the substrate recessed part 61b of the substrate buildup part 61a of the substrate sheet 61.
NAGASHIMA MASAYUKI
UCHIUMI TSUTOMU
| JP2005340230A | 2005-12-08 | |||
| JP2006173460A | 2006-06-29 | |||
| JPH06120229A | 1994-04-28 | |||
| JP2010052223A | 2010-03-11 |
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroki Kashima