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Patent Searching and Data


Title:
METHOD OF MANUFACTURING SUBSTRATE WITH FILM
Document Type and Number:
Japanese Patent JP2008135484
Kind Code:
A
Abstract:

To provide a method of manufacturing a substrate with film by which a liquid material is used to efficiently form an organic film and to make a substrate with film.

This method is used to form an organic film on the upper surface (film formation face) of a wafer 10 and manufacture a substrate with film. The method includes a first step to vaporize a liquid material containing organic substance for forming the organic film and a second step to bring the vaporized organic substance into contact with the upper surface of the wafer 10 for condensation and organic film formation while cooling the upper surface of the wafer 10 and a substrate with film is obtained as a result. In the second step, it is preferable to house the wafer 10 in a chamber 2 and process it while heating the chamber 2.


Inventors:
NISHIJIMA TATSUMI
Application Number:
JP2006319341A
Publication Date:
June 12, 2008
Filing Date:
November 27, 2006
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H05K3/28
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi