Title:
平坦化膜を具備する基板の製造方法
Document Type and Number:
Japanese Patent JP7125308
Kind Code:
B2
Abstract:
To provide a method for producing a substrate having a flattening film, which can form a flattening film having excellent flatness and solvent resistance on a substrate having a step on the surface.SOLUTION: A method for producing a substrate having a flattening film 2 has: a coating film forming step in which an energy-sensitive composition containing an energy-sensitive curing agent (A) and an aromatic vinyl ether compound (B) with a molecular weight of 1000 or less, and not containing trimeric or larger polymer components, is applied to a substrate 1 having a step on the surface, to form a coating film; a preliminary curing step in which a coating film is preliminarily cured by heating at 150°C-250°C to obtain a preliminary cured film with an average molecular weight of more than 1000 and 10000 or less; and a final curing step in which the preliminary cured film is cured by heating and/or exposure at a higher temperature than the heating temperature in the preliminary curing step to form a final cured film.SELECTED DRAWING: Figure 1
Inventors:
Butterfly Ensei
Dai Shioda
Hiroki Chisaka
Shunichi Mashita
Dai Shioda
Hiroki Chisaka
Shunichi Mashita
Application Number:
JP2018163992A
Publication Date:
August 24, 2022
Filing Date:
August 31, 2018
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
B32B27/30; B32B37/06; C08F2/46; C08F16/12
Domestic Patent References:
| JP2016068279A | ||||
| JP2015014781A | ||||
| JP2015179171A | ||||
| JP2005111702A |
Foreign References:
| WO2018116988A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi