Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MANUFACTURING METHOD OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2018075694
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate capable of manufacturing a small-sized substrate excellent in quality while restraining the possibility of damage low.SOLUTION: A manufacturing method includes a material substrate preparation step of preparing a material substrate, a groove forming step of forming a groove of the depth of exceeding a predetermined thickness and not reaching a second surface so as to partition an area of becoming a small-sized substrate by cutting in a grindstone tool from a first surface of the material substrate, a chipping removing step of removing chipping of the edge of the groove by grinding the first surface side of the material substrate for forming the groove by a grinding grindstone, a protective member sticking step of sticking a protective member to the first surface side of the material substrate after executing the chipping removing step, a separation step of separating the small-sized substrate from the material substrate by exposing the groove to the second surface side by thinning the material substrate up to a predetermined thickness by grinding the second surface side of the material substrate by the grinding grindstone after executing the protective member sticking step, and a separation step of separating a small diameter substrate by separating the protective member from the small-sized substrate after executing the separation step.SELECTED DRAWING: Figure 4

More Like This:
WO/2021/089724POLISHING TANK HAVING A REMOVABLE INSERT MODULAR SYSTEM AND INTEGRATED SENSORS
WO/2016/072370POLISHING METHOD AND COMPOSITION FOR POLISHING
Inventors:
SUZUKI MASAAKI
KUNISHIGE HITOSHI
Application Number:
JP2016220826A
Publication Date:
May 17, 2018
Filing Date:
November 11, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B1/00; B24B7/04; B24B27/06; B28D5/02; H01L21/304
Domestic Patent References:
JP2010182753A2010-08-19
JPH02303050A1990-12-17
JP2014110411A2014-06-12
JP2015182175A2015-10-22
JP2012009550A2012-01-12
JP2005033190A2005-02-03
Foreign References:
EP1022778A12000-07-26
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro



 
Previous Patent: Desk cutting machine

Next Patent: Gripper