To provide a method for manufacturing copper foil having excellent strength of adhesion to a substrate and heat resistance strength.
The method for manufacturing the surface treated copper foil for a microfabrication circuit substrate suitable for production of the substrate having a microfabrication circuit pattern comprises steps of; arranging the copper foil as a cathode in an electroplating bath including Co, Ni, ammonium salt, and citric acid and precipitating and forming a roughening treatment layer of a Co-Ni alloy on the copper foil surface in such a manner that its surface roughness attains ≤0.5 μm; forming a pure Zn or Zn alloy coating layer on the roughening treatment layer; forming an electrolytic chromate layer on the coating layer; and forming a silane coupling agent treatment layer on the electrolytic chromate layer. The manufactured surface treated copper foil is excellent overall in the requirement characteristics as the copper foil, such as the strength of adhesion to the substrate, heat resistant strength of adhesion, chemical resistance, and etching, and is particularly suitable as the copper foil for the microfabrication circuit substrate.
TEI SHORYO
KIM SANG-BUM
| JP2001288595A | 2001-10-19 | |||
| JP2003201585A | 2003-07-18 | |||
| JPH1060680A | 1998-03-03 | |||
| JPH10212591A | 1998-08-11 | |||
| JP2002212773A | 2002-07-31 | |||
| JPH1110794A | 1999-01-19 |
Kenichiro Akao
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