Title:
熱硬化性フラックス組成物および電子基板の製造方法
Document Type and Number:
Japanese Patent JP6766087
Kind Code:
B2
Abstract:
To provide a thermosetting flux composition having a high reinforcing effect by a cured product, excellent insulation properties of the cured product, and excellent solderability.SOLUTION: A thermosetting flux composition of the present invention is used when an electronic component having a solder bump made of a solder alloy having a melting point of 130°C or higher and 240°C or lower is bonded to an electronic substrate by reflow soldering or thermocompression bonding, and contains (A) an oxetane compound, (B) an activator, and (C) an inorganic filler, wherein the component (A) contains (A1) a bifunctional oxetane compound having two oxetane rings in one molecule, and wherein the component (B) contains (B1) an organic acid. When the temperature of the thermosetting flux composition is increased from 25°C at a rate of temperature rise of 5°C/min, the thermosetting flux composition exhibits a viscosity of 5 Pa s or less at 200°C, and a viscosity of 50 Pa s or more at 250°C.SELECTED DRAWING: None
Inventors:
Kisei Iijima
Akira Kitamura
Yusuke Taniguchi
Akira Kitamura
Yusuke Taniguchi
Application Number:
JP2018056733A
Publication Date:
October 07, 2020
Filing Date:
March 23, 2018
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K35/363; B23K1/00; B23K3/00; H05K3/34
Domestic Patent References:
| JP2018157007A | ||||
| JP2011036901A | ||||
| JP2017162960A | ||||
| JP2007280999A |
Foreign References:
| WO2017110052A1 |
Attorney, Agent or Firm:
Intellectual Property Office