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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING TRANSFER DIE AND THE TRANSFER DIE
Document Type and Number:
Japanese Patent JP2013108169
Kind Code:
A
Abstract:

To provide a transfer die for forming components by electroforming, good in workability and excellent in durability.

This method for manufacturing a transfer die includes the steps of: forming a resist reinforcing groove 15 in a metal substrate; forming an inverse resist pattern 20 on the resist reinforcing groove 15, the inverse resist pattern having height exceeding the depth of the groove while covering the groove, and having a shape of a component including a sidewall with a desired angle α; and allowing the inverse resist pattern to be heat cured. An edge of the inverse resist pattern is reinforced with the resist reinforcing groove, so that the inverse resist pattern is prevented from being peeled at the edge.


Inventors:
SANO TAKASHI
TERADA TSUNENORI
Application Number:
JP2012166204A
Publication Date:
June 06, 2013
Filing Date:
July 26, 2012
Export Citation:
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Assignee:
LEAP CO LTD
International Classes:
C25D1/10; C25D1/00
Domestic Patent References:
JP2007092097A2007-04-12
JP2005163076A2005-06-23
JPH05339778A1993-12-21
JPS625235B21987-02-03
Attorney, Agent or Firm:
Makoto Hagiwara