Title:
METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE SHEET
Document Type and Number:
Japanese Patent JP2020170755
Kind Code:
A
Abstract:
To solve the problem that a photolithographic technique has been used in forming a groove structure in a resist conventionally, which has not been suitable for continuously processing a base material wound like a roll.SOLUTION: A method for manufacturing a transparent conductive sheet comprises the steps of: forming a transparent plating primer layer on a flexible transparent base material; forming a permanent resist layer on the plating primer layer; forming a groove structure by imprinting the permanent resist layer; plasma etching the whole permanent resist layer to remove the permanent resist layer left on a bottom of the groove structure, thereby exposing the plating primer layer; and performing a plating process on the plating primer layer. In the method for manufacturing the transparent conductive sheet, the groove structure is formed by imprinting and therefore, the method is rich in mass productivity.SELECTED DRAWING: Figure 1
Inventors:
TAKESHITA SOYA
SAITO KUNIHARU
SAITO KUNIHARU
Application Number:
JP2019070171A
Publication Date:
October 15, 2020
Filing Date:
April 01, 2019
Export Citation:
Assignee:
KOINEX CO LTD
YODOGAWA HU TECH KK
YODOGAWA HU TECH KK
International Classes:
H05K3/10; B05D3/04; B05D3/12; B05D7/00; B05D7/24; B32B3/30; B32B7/025; B32B37/02; B32B38/04; B32B38/10; C23C26/00; H01B13/00; H05K3/18
Attorney, Agent or Firm:
Masaki Hiroyuki