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Title:
METHOD OF MANUFACTURING TWO-LAYER COPPER CLAD LAMINATED SHEET, AND TWO-LAYER COPPER CLAD LAMINATED SHEET
Document Type and Number:
Japanese Patent JP2010260328
Kind Code:
A
Abstract:

To provide a method of manufacturing a two-layer copper clad laminated sheet which can further inhibit oxidation discoloration after a heat treatment which raises folding resistance in the two-layer copper clad laminated sheet (two-layer CCL material) wherein a copper layer is formed on a polyimide film by sputtering and plating, and to provide the two-layer copper clad laminated sheet.

The two-layer copper clad laminated sheet is obtained by forming a metal layer of one selected from Ni, Co, and Cr or an alloy layer consisting of two or more of them on a polyimide film by sputtering; forming a copper layer on the metal layer or the alloy layer by sputtering or plating; and further forming a layer consisting of Cr and/or Cr oxide on the copper layer.


Inventors:
HANABUSA MIKIO
Application Number:
JP2009130276A
Publication Date:
November 18, 2010
Filing Date:
May 29, 2009
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
B32B15/088; B32B15/08; C23C14/06; H05K1/09
Domestic Patent References:
JPH07197239A1995-08-01
JP2006159631A2006-06-22
JP2009004588A2009-01-08
JP2002172734A2002-06-18
JP2007318177A2007-12-06
JP2004158493A2004-06-03
JP2008162245A2008-07-17
JP2007302003A2007-11-22
JP2006159632A2006-06-22
JPH05259596A1993-10-08
JP2006159631A2006-06-22
JP2009004588A2009-01-08
JP2002172734A2002-06-18
JP2007318177A2007-12-06
JP2004158493A2004-06-03
JP2008162245A2008-07-17
JP2007302003A2007-11-22
JPH07197239A1995-08-01
Foreign References:
WO2008065890A12008-06-05
WO2008065890A12008-06-05
Attorney, Agent or Firm:
Isamu Ogoshi