To provide a method of manufacturing a two-layer copper clad laminated sheet which can further inhibit oxidation discoloration after a heat treatment which raises folding resistance in the two-layer copper clad laminated sheet (two-layer CCL material) wherein a copper layer is formed on a polyimide film by sputtering and plating, and to provide the two-layer copper clad laminated sheet.
The two-layer copper clad laminated sheet is obtained by forming a metal layer of one selected from Ni, Co, and Cr or an alloy layer consisting of two or more of them on a polyimide film by sputtering; forming a copper layer on the metal layer or the alloy layer by sputtering or plating; and further forming a layer consisting of Cr and/or Cr oxide on the copper layer.
JPH07197239A | 1995-08-01 | |||
JP2006159631A | 2006-06-22 | |||
JP2009004588A | 2009-01-08 | |||
JP2002172734A | 2002-06-18 | |||
JP2007318177A | 2007-12-06 | |||
JP2004158493A | 2004-06-03 | |||
JP2008162245A | 2008-07-17 | |||
JP2007302003A | 2007-11-22 | |||
JP2006159632A | 2006-06-22 | |||
JPH05259596A | 1993-10-08 | |||
JP2006159631A | 2006-06-22 | |||
JP2009004588A | 2009-01-08 | |||
JP2002172734A | 2002-06-18 | |||
JP2007318177A | 2007-12-06 | |||
JP2004158493A | 2004-06-03 | |||
JP2008162245A | 2008-07-17 | |||
JP2007302003A | 2007-11-22 | |||
JPH07197239A | 1995-08-01 |
WO2008065890A1 | 2008-06-05 | |||
WO2008065890A1 | 2008-06-05 |