Title:
METHOD FOR MANUFACTURING VARIABLE-RESISTANCE ELEMENT IN COPPER WIRING LAYER
Document Type and Number:
Japanese Patent JP2018174227
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a variable-resistance element in a copper wiring layer, by which a foreign material like a particle can be removed while holding flatness of a copper surface used as an activation electrode.SOLUTION: A method for manufacturing a variable-resistance element having an insulative barrier film on a copper wiring line doubling as an activation electrode of a variable-resistance element, and arranged so that the insulative barrier film is opened to expose a part of the copper wiring line as an activation electrode comprises: a first step of removing a foreign material like a particle on an insulative barrier film surface, including the opening after a step of exposing an activation electrode surface; a second step of removing an oxide film over the copper surface; and a third step of forming a variable-resistance film. The second and third steps are continuously performed without exposure to the atmospheric air at a pressure lower than an atmospheric pressure.SELECTED DRAWING: Figure 1
Inventors:
OKAMOTO KOICHIRO
TADA MUNEHIRO
TOMONO NAOKI
IGUCHI NORIYUKI
TADA MUNEHIRO
TOMONO NAOKI
IGUCHI NORIYUKI
Application Number:
JP2017071545A
Publication Date:
November 08, 2018
Filing Date:
March 31, 2017
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/8239; H01L21/304; H01L27/105; H01L45/00; H01L49/00
Domestic Patent References:
| JP2013197451A | 2013-09-30 | |||
| JP2006344749A | 2006-12-21 |
Foreign References:
| WO2007017939A1 | 2007-02-15 | |||
| WO2017051527A1 | 2017-03-30 |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata