To provide a method of manufacturing a slot antenna substrate having high dimensional accuracy of an antenna opening in a waveguide slot antenna substrate with a through-hole and the antenna opening.
The method has a half etching step of reducing the film thickness of a copper foil 2 of a copper-clad substrate 1, a boring step of forming a through-hole 4a in a desired region of the copper foil 2, an electroless plating step of making the copper foil 2 and an inner wall surface of the through-hole 4a conductive by immersing the copper-clad substrate 1 in a solution, a photoengraving step of forming an antenna opening 3 whose periphery is enclosed with the copper foil 2 in a region except a desired region, a waveguide connection pattern formation step of forming a waveguide transforming part 5a whose periphery is enclosed with the copper foil 2 in a region except a desired region separated from the antenna opening 3, an inspection step of measuring the size of the formed antenna opening 3 and an electrolytic plating step of forming a metal layer 8 laminated in the inner wall surface of the through-hole 4a and laminated in the outer circumference of the antenna opening.
ISOBE YOSHIAKI
FUJIWARA HIROSUKE
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
Next Patent: DEVICE FOR ADDING AUDIO SIGNAL