Title:
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022190665
Kind Code:
A
Abstract:
To provide a method for manufacturing a wiring circuit board capable of uniformizing a thickness of a conductor pattern formed near an opening.SOLUTION: A method for manufacturing a wiring circuit board 1 includes first to fourth steps. The first step sets a pattern formation region A11 and an opening formation region A12 in a support layer 11. The second step forms a base insulation layer 12 on the support layer 11 in at least the pattern formation region A11. The third step forms a conductor pattern 13 on the base insulation layer 12 in the pattern formation region A11 by electrolytic plating and forms a dummy pattern 22 in the opening formation region A12. The fourth step etches at least a part of the support layer 11 in the opening formation region A12.SELECTED DRAWING: Figure 7
Inventors:
TAKAKURA HAYATO
SHIBATA NAOKI
FUKUI REI
TANAKA TOMOAKI
SHIBATA NAOKI
FUKUI REI
TANAKA TOMOAKI
Application Number:
JP2022062685A
Publication Date:
December 26, 2022
Filing Date:
April 04, 2022
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H05K3/18; H05K3/00; H05K3/06
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda
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