METHOD FOR MANUFACTURING WIRING BOARD

Japanese Patent JP2017101300

A

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board allowing for formation of a metal film F having a more uniform film thickness on a base layer U formed on a resin substrate B.SOLUTION: A method for manufacturing a wiring board: comprises a step of dividing a surface Ba of a resin substrate B into a plurality of film-formation regions C1 to C4; a step of calculating areas of base layers U existing in each of the divided film-formation regions C1 to C4; a step of calculating current values for each of the film-formation regions C1 to C4 so that thicknesses of metal films for each of the film-formation regions C1 to C4 become the same thickness using the calculated areas of the base layers U; and a step of sequentially selecting the divided film-formation regions C1 to C4. The above steps are implemented and steps 34-35 are repeated, and other film-formation regions are masked so that the base layer U of the selected film-formation region is exposed, and a metal film F is formed on the base layer U existing in the selected film-formation region with a current value according to the selected film-formation region.SELECTED DRAWING: Figure 4

JP2006507405	Equipment and methods for electrochemically treating substrates while reducing metal corrosion
JP3490238	PLATING TREATMENT DEVICE AND PLATING TREATMENT
JP4064132	Substrate processing equipment and substrate processing method

IIZAKA HIROFUMI
YANAGIMOTO HIROSHI
HIRAOKA MOTOKI
SATO YUKI

JP2015236490A

June 08, 2017

December 03, 2015

Click for automatic bibliography generation  

TOYOTA MOTOR CORP

C25D17/00; C25D5/02; C25D7/00; C25D21/12; H05K3/18

Yusuke Hiraki
Sekiya Mitsuo
Ishikawa Takiharu
Yasuhiko Mima

Previous Patent: A hot-rolled steel product and a manufacturing method for the same

Next Patent: A method for film deposition of a copper coat