Title:
METHOD FOR MEASURING CHARACTERISTICS OF SUBSTRATE, INSPECTION DEVICE, LITHOGRAPHY SYSTEM, AND DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2022058401
Kind Code:
A
Abstract:
To provide a method for measuring characteristics of a substrate on which a plurality of targets is formed, an inspection device, a lithography system, and a device manufacturing method.SOLUTION: A method for measuring characteristics of a substrate includes: measuring N pieces of targets out of a plurality of targets by using an optical measurement system, N is an integer of 3 or more, measuring each of the N pieces of targets for Wt times so as to obtain N*Wt pieces of measured values, in which Wt is an integer of 3 or more; and obtaining R pieces of characteristic values by using Q pieces of expressions and N*Wt pieces of measured values, in which R
Inventors:
WARNAAR PATRICK
SCHAAR MAURITS VAN DER
GRZEGORZ GRZELA
KOOP ERIK JOHAN
VICTOR EMANUEL CALADO
ZENG SI-HAN
SCHAAR MAURITS VAN DER
GRZEGORZ GRZELA
KOOP ERIK JOHAN
VICTOR EMANUEL CALADO
ZENG SI-HAN
Application Number:
JP2021209954A
Publication Date:
April 12, 2022
Filing Date:
December 23, 2021
Export Citation:
Assignee:
ASML NETHERLANDS BV
International Classes:
G03F9/00; G01B11/02; H01L21/66
Domestic Patent References:
| JP2012169617A | 2012-09-06 | |||
| JP2014527633A | 2014-10-16 |
Foreign References:
| US20160223322A1 | 2016-08-04 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito