Title:
METHOD FOR MEASURING DIAMETER OF WIRE AND MULTI-WIRE SAW USING THE SAME
Document Type and Number:
Japanese Patent JP3198885
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a wire from being ruptured during cutting by forming a solenoid coil with a specified diameter around the used wire and measuring the diameter of the wire from the variation in the inductance of the solenoid coil.
SOLUTION: In a multi-wire saw for cutting semiconductor crystals, oxide crystals, etc., in a wafer shape, a solenoid coil 5 is formed around a used wire 3. A parallel type LC oscillation circuit 6 is connected to the solenoid coil 5, and the variation in inductance is converted into the oscillation frequency of the circuit 6. Next, the oscillation frequency is measured by a frequency counter 7 and operated by a microcomputer 8 to be converted into the diameter of the wire 3, and the supply of a new wire 2 is changed to make the diameter constant. Besides, the diameter of the solenoid coil 5 is 2-20 times the diameter of the new wire.
Inventors:
Akikazu Tanaka
Application Number:
JP22990795A
Publication Date:
August 13, 2001
Filing Date:
September 07, 1995
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B28D5/04; B24B27/06
Domestic Patent References:
| JP7205015A | ||||
| JP6206146A | ||||
| JP5280914A | ||||
| JP8174402A |