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Title:
METHOD FOR MEASURING FILM THICKNESS OF THIN FILM
Document Type and Number:
Japanese Patent JP2001343227
Kind Code:
A
Abstract:

To enable a film thickness of extremely thin films to be measured even when common elements are included in substrates and the thin films.

An energy distribution of photoelectrons excited by applying X rays to a measurement object with the thin film formed on the substrate is measured. Elements not common are obtained from elements contained in the substrate and the thin film with the use of the photoelectron energy distribution. An atomic concentration of the element peculiar to the substrate and an atomic concentration of the element peculiar to the thin film are obtained. A photoelectron intensity ratio is obtained from a ratio of the atomic concentrations of the elements peculiar to the substrate and the thin film. The photoelectron intensity ratio is applied to a relation expression between the film thickness and the photoelectron intensity ratio, whereby the film thickness of the thin film is measured.


Inventors:
MAKI TORU
Application Number:
JP2000165878A
Publication Date:
December 14, 2001
Filing Date:
June 02, 2000
Export Citation:
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Assignee:
SHIMADZU CORP
International Classes:
G01B15/02; G01N23/227; G11B5/31; G11B5/84; (IPC1-7): G01B15/02; G01N23/227; G11B5/31; G11B5/84
Attorney, Agent or Firm:
Matsumoto Takemoto (1 person outside)