To provide a method for measuring characteristics of an electronic part element for high frequency use with high accuracy.

A first conductor layer 2, a first insulating layer 3, a second conductor layer 4 and a second insulating layer 5 are sequentially laminated on a support substrate 1 to form an evaluation substrate A for mounting. Further, the evaluation substrate A for mounting comprises a plurality of pads for mounting and a plurality of probe contact pads 7a, 7b. Component of parastic impedance of the evaluation substrate A for mounting is compensated based on results of the characteristics obtained by using the evaluation substrate A for mounting, an evaluation substrate B for opening and an evaluation substrate C for short circuit. The high frequency characteristics of the electronic part element D mounted on the evaluation substrate A for mounting are, then, evaluated.