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Title:
METHOD OF MEASURING STRAIN OF IMPROVED SOIL
Document Type and Number:
Japanese Patent JP2009209601
Kind Code:
A
Abstract:

To provide a method of measuring strain of improved soil, by easily sticking a strain measuring device to a surface of a specimen in a manner resisting easy peeling of the same, to thereby measure correct strain of the specimen.

The method of measuring the strain of the improved soil includes: a step of coating putty 11 to the surface of the specimen 10 to form a coated film on the surface; a step of drying the coated film; and a step of sticking a strain gauge 12 for measuring the strain of the specimen 10, to the coated film. The improved soil for use in the specimen 10 can have a water content of 85% or less, and the putty 11 is coated to the specimen at the thickness on the order of 0.1 mm.


Inventors:
IMAMURA SHINICHIRO
Application Number:
JP2008054701A
Publication Date:
September 17, 2009
Filing Date:
March 05, 2008
Export Citation:
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Assignee:
NISHIMATSU CONSTR CO LTD
International Classes:
E02D3/12; E02D1/04; G01B7/16; G01N33/24
Other References:
JPN6012051777; 吉田 輝 外3名: 'ひずみゲージにより測定した地盤改良体の変形特性' 土木学会第57会年次学術講演会 , 200209, P.53〜54, 社団法人土木学会
JPN6012051779; 青木智幸 外4名: '高温度下の珪藻泥岩の力学特性変化' 土木学会第58会年次学術講演会 , 200309, P.387〜388, 社団法人土木学会
JPN6012051781; 川嶋幾夫 外1名: '曲面に貼付されたひずみゲージの測定誤差に関する考察' 土木学会論文集 No.454、3-20, 199209, P.127〜130, 社団法人土木学会
Attorney, Agent or Firm:
Patent Corporation MIP