METHOD FOR MEASURING TEMPERATURE OF SOLDERING IRON AND SOLDERING APPARATUS

Japanese Patent JP3456112

B2

PROBLEM TO BE SOLVED: To measure the temperature of a soldering iron more accurately by making a containing hole in the circumferential wall of a soldering iron and containing a temperature sensor in the containing hole thereby blocking the flow of molten solder.
SOLUTION: A containing hole 50 is made in the forward end part of a soldering iron 1 while directing toward the center in the forward end part. The temperature measuring part of a temperature sensor, i.e., a thermocouple 51, is contained in the containing hole 50 and a heater 52 arranged in the soldering iron 1 is subjected to conduction control based on the temperature measured by means of the thermocouple 51. The containing hole 50 is extended from a position on the outer circumference of the soldering iron 1 (opening of the containing hole 50) toward the forward end part thereof to a position intersecting the axis P of the soldering iron 1. Consequently, a containing hole 50 of small diameter can be made and the distance L between the forward end of a containing hole 50 having diameter of 0.3 mm and the forward end of the soldering iron 1 can be set as short as about 0.5 mm and the temperature can be measure more accurately. Furthermore, since the temperature measuring part of the thermocouple 51 is contained in the containing hole 50, welded part thereof does not block the molten solder flow.

Akira Nishino
Naoki Nishimori

JP14882997A

October 14, 2003

June 06, 1997

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Omron Corporation

B23K3/02; B23K3/00; B23K3/03; B23K3/06; G01K1/14; G01K7/02; G01L1/14; (IPC1-7): B23K3/02; B23K3/00; B23K3/03; G01K1/14

JP740037A
JP635869A
JP60102272A
JP8219899A

Kazuhide Okada

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