To provide a method for measuring temperature by which the temperature distribution in a hot plate incorporated in a heat-treating unit during an actual process can be measured easily and accurately, and a coating and developing system.

In a method for measuring temperature, a coating solution which forms a film of different thickness in coping with temperature changes is applied to a dummy wafer W for measurement, and the wafer W is placed on a hot plate 152 incorporated in a heat-treating unit. Then the thickness of the film formed of the applied solution on the wafer W is measured. As a result, the temperature distribution in the hot plate 152 can be comprehended by computing the temperature distribution in the wafer W corresponding to the thickness distribution of the film.