Title:
METHOD FOR MEASURING VISCOSITY OF SOLDER PASTE SOLDER PASTE PRINTING MACHINE
Document Type and Number:
Japanese Patent JPH0599831
Kind Code:
A
Abstract:
PURPOSE: To enable a viscosity of a solder paste on a solder paste printing machine and its continuous change at the time of actual printing to be measured.
CONSTITUTION: A flow speed of a solder paste 6 at a solder paste release part 9 is measured by a laser sensor 7 for measuring an amount of travel. A relative relationship between viscosity of the solder paste 6 which is obtained previously and flow speed is compared with the flow speed of the measured cream solder 6, thus obtaining the viscosity of the solder paste 6 at the time of actual printing and its continuous change.
Inventors:
KAWABE YASUHIRO
KOBAYASHI MICHITOKU
KOBAYASHI MICHITOKU
Application Number:
JP29218891A
Publication Date:
April 23, 1993
Filing Date:
October 11, 1991
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
G01N11/00; G01N21/85; H05K3/34; (IPC1-7): G01N11/00; G01N21/85; H05K3/34
Attorney, Agent or Firm:
Funabashi Kuninori
Next Patent: DYNAMIC SURFACE TENSION MEASURING DEVICE