Title:
METHOD FOR MOLDING CIRCUIT BODY AND MOLD STRUCTURE USED IN THE METHOD
Document Type and Number:
Japanese Patent JP3269024
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the generation of a short shot in a resin and the rotation of bus bars and to try to give strength by thickening press pins by a method in which after the bus bars were inserted between press pins to be arranged in a zigzag shape of a mold and arranged at narrow intervals, the resin is molded between the bus bars, and a circuit body is formed.
SOLUTION: Bus bars 12 are inserted into the cavity 13 of a mold 11, inserted between press pins 14, and held by adjoining press pins 14 to eliminate mutual contact. Mold clamping is done in this state, and a molten resin is injected into the mold 11, cast between the bus bars 12 and press pins 14, cured, and made to be a resin molding part which holds the bus bars 12 in a noncontact state. In this form, the adjacent press pins 14 are in the shape of a plover, are not positioned on the same line in the arrangement direction of bus bars 12, and are in a separated state, and the press pins 14 and the bus bars 12 are not collected closely. In this way, the generation of the short shot of the resin and contact by the rotation of the bus bars 12 are prevented, and the press pins 14 can be made thick and strong.
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Inventors:
▲高▼▲橋▼ 俊晴
Application Number:
JP10492498A
Publication Date:
March 25, 2002
Filing Date:
April 15, 1998
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
B29C33/12; B29C45/14; H01L21/56; H05K3/20; B29K101/12; B29L31/34; H05K3/00; (IPC1-7): B29C45/14; B29C33/12; H01L21/56
Domestic Patent References:
| JP2148876A | ||||
| JP464414A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)