Title:
METHOD FOR MOLDING SLURRY
Document Type and Number:
Japanese Patent JPH1110612
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To eliminate overflow of slurry from a mold even when the mold is obliquely placed with easy defoaming of a surface by constituting the mold by a case-like body and cover, and charging the slurry so as to form an air layer between an upper surface of the slurry cast in the body and a rear surface of the cover. SOLUTION: A mold 1 has a case-like body 11 and cover 12. And, the cover 12 can seal an opening of the body 11. Slurry 2 obtained by mixing filler such as curing agent or other silica sand with alkali silicate water solution by an omni-mixer is cast in the body 11 placed horizontally. Then, after it is heated in the state that an air layer 3 is formed between an upper surface of the slurry 2 and a rear surface of the cover 12 by sealing it with the cover 12 in an oven for a predetermined time, it is released from a mold to manufacture inorganic cured material 4. Defoaming of the surface of the slurry 2 is easy. Even when the mold is obliquely placed, the slurry 2 can be eliminated to overflow from the mold and to contaminate the cover 12 or the body 11.
Inventors:
KOIKE TAKERU
Application Number:
JP17046397A
Publication Date:
January 19, 1999
Filing Date:
June 26, 1997
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B28B1/14; (IPC1-7): B28B1/14
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