Title:
METHOD FOR MOLDING WIRE CONDUCTOR APPLIED TO ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2019087721
Kind Code:
A
Abstract:
To provide a method for molding a wire conductor applied to an electronic component.SOLUTION: In a method for molding a wire conductor applied to an electronic component, an insulating rubber sheet is integrally molded by injection mold of a plastic material. The insulating rubber sheet includes a body and molding units arranged with two or more gaps therebetween in the body. A top mold of a transfer jig reciprocates on a transfer portion of a bottom mold by an adhesive-applying portion. The adhesive-applying portion coats a conductive adhesive on a surface of the transfer portion and inverts the insulating rubber sheet. The molding units is downwardly in contact with the transfer portion of the bottom mold, transfer the conductive adhesive onto the surfaces of a plurality of U-shaped plates of respective molding units, and then remove the insulating rubber sheet from the bottom mold. The conductive adhesive molds, through baking or ultraviolet curing process, individual conductors separated from each other on the surfaces of the respective U-shaped plates. The method can accurately control the formation direction and density of the conductors based on needs, ensures manufacturing quality and yield, and achieves simplification in craft, high production efficiency and cost saving.SELECTED DRAWING: Figure 1
Inventors:
MO JIA PING
LIU YOUZHI
LIU YOUZHI
Application Number:
JP2018050497A
Publication Date:
June 06, 2019
Filing Date:
March 19, 2018
Export Citation:
Assignee:
AJOHO ENTPR CO LTD
International Classes:
H01F41/04; H01B13/00; H01F5/00
Attorney, Agent or Firm:
Eiichi Ohara