Title:
METHOD OF MONITORING CUTTING ACTION WHEN SLICING SEMICONDUCTOR MATERIAL USING INNER PERIPHERY BLADE TYPE SAW AND EDDG CURRENT SENSOR TO IMPLEMENT THIS METHOD
Document Type and Number:
Japanese Patent JPH02266520
Kind Code:
A
Abstract:
PURPOSE: To monitor the track of a saw blade inside a work piece by using an eddy current sensor provided with a cover composed of a semiconductor material on a surface turned toward the saw blade. CONSTITUTION: When monitoring cutting operation while using the eddy current sensor at a fixed position to the saw blade, the eddy current sensor provided with the cover composed of the semiconductor material on the surface turned toward the saw blade is used. It is effective to use silicon as the semiconductor material for the cover but principly, an element semiconductor or a compound semiconductor is suitable and it is effective to use such a material while being doped at a high level. Thus, the measured result effective for monitoring the cutting operation is not made erroneous without being affected by a cooling lubricant.
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Inventors:
HERUMUUTO ZEEBURUGAA
Application Number:
JP4464690A
Publication Date:
October 31, 1990
Filing Date:
February 27, 1990
Export Citation:
Assignee:
WACKER CHEMITRONIC
International Classes:
H01L21/66; B23D59/00; B28D5/02; G01D5/20; H01L21/304; (IPC1-7): H01L21/304; H01L21/66
Domestic Patent References:
| JPH01210271A | 1989-08-23 | |||
| JPS637503B2 | 1988-02-17 | |||
| JPS61260102A | 1986-11-18 |
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)
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