Title:
METHOD OF MOUNTING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2005064225
Kind Code:
A
Abstract:
To provide a method of mounting electronic components closely as much as possible on a substrate.
The method of mounting disposes a first and second electronic components (2) face to face, and connects leads (3) extending from the first and second electronic components to a substrate. It comprises a step bending the middles of the leads, and a step connecting the leads extending from the first and second electronic components to the substrate so as to be separated from each other.
Inventors:
SUGIHARA KATSUMICHI
OKI NORITOMO
MAEHARA HIDEO
OKI NORITOMO
MAEHARA HIDEO
Application Number:
JP2003292149A
Publication Date:
March 10, 2005
Filing Date:
August 12, 2003
Export Citation:
Assignee:
KAYABA INDUSTRY CO LTD
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Attorney, Agent or Firm:
Masaki Goto
Yoshio Matsuda
Yoshio Matsuda