To provide a method of mounting an electronic component which prevents the mixture of a bonding material and a reinforcing resin and secure mounting quality in an embodiment using the reinforcing resin together with the bonding material.
In mounting of the electronic component which mounts an electronic component 8 on the lower surface of which a bump 9 is provided on a substrate by solder bonding, solder paste 6 is printed on an electrode 5, and then the position of the solder paste 6 is detected in print inspection and it is output as solder paste position data. The control parameter of an application device which applies the reinforcing resin is updated based on the solder paste position data in the resin application step of applying reinforcing resins 7A, 7B, 7C, and 7D on a corner portion beforehand and the positions of application of the application device reinforcing resins 7A, 7B, 7C, and 7D are corrected. The overlapping and application of the reinforcing resin on the printed solder paste 6 is thereby prevented.
| JP2003034012 | CREAM SOLDER PRINTING APPARATUS |
| JPH05167241 | LASER REFLOW JIG |
| JPH07161766 | SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF |
INOUE MASAFUMI
| JP2005183715A | 2005-07-07 | |||
| JPH10112478A | 1998-04-28 | |||
| JP2002271014A | 2002-09-20 | |||
| JP2007287779A | 2007-11-01 |
Daisuke Nagano
Kentaro Fujii
Next Patent: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND EXPOSURE APPARATUS