PURPOSE: To reduce defective soldering while improving reliability and workability by positioning and fixing an electronic part at a required relative position to a part mounting hole by an adhesive tape and soldering the electronic part to a board.

CONSTITUTION: An adhesive tape 7 in proper size is stuck onto the rear of a board 1, a chip part 4 is housed so as to be accurately positioned at a necessary relative position to a part mounting hole 2, the rear of the chip part 4 is fastened by the adhesive tape 7, and the chip part 4 is held at the precise position of housing. Consequently, the chip part 4 is positioned and fixed correctly into the part mounting hole 2, and board electrodes and part electrodes 3a and 5a, 3b and 5b corresponding to the board electrodes are soldered 6 respectively. Since the chip part 4 is soldered 6 and connected under the state in which it is positioned accurately into the part mounting hole 2, the quantities of solder 6 in each connecting section are made proper, thus acquiring appropriate strength, and improving reliability.