Title:
METHOD OF MOUNTING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPH06168981
Kind Code:
A
Abstract:
PURPOSE: To improve reliability of electric connection of a semiconductor chip and a substrate wiring circuit, and increase the efficiency of mounting work.
CONSTITUTION: Solid resin is arranged in a semiconductor element mounting region of a light transmitting substrate 9 on which a wiring circuit is formed, and a semiconductor element 18 is mounted via the solid resin. While the resin is heated, the semiconductor element 18 is pressed against the substrate 9, and the solid resin layer is fused. In the state that the pressure is applied, the fused resin is cured by heating or cooling, and the semiconductor element 18 is fixed on the light transmitting substrate 9.
Inventors:
SONOHATA HIDETAKA
MIYAZAKI MITSUO
MIYAZAKI MITSUO
Application Number:
JP31990392A
Publication Date:
June 14, 1994
Filing Date:
November 30, 1992
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
G02F1/1345; H01L21/52; H01L21/60; H01L23/12; (IPC1-7): H01L21/60; G02F1/1345; H01L21/52; H01L23/12