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Title:
METHOD OF OPTIMIZING THICKNESS ADJUSTMENT FOR ADHESIVE BINDING MACHINE
Document Type and Number:
Japanese Patent JP2016007859
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for optimizing thickness adjustment for an adhesive binding machine, which reduces incidentally-generated defective binding.SOLUTION: A method for optimizing thickness adjustment for an adhesive binding machine includes: (a) a step of determining thickness D of a book block 100; (b) a step of inputting the thickness D of the book block 100 in a control unit 4 of the adhesive binding machine; (c) a step of roughly adjusting a plurality of components and a plurality of stations of the adhesive binding machine; (d) a step of supplying the first book block 100 to the adhesive binding machine, processing the concerned book block 100 at least partially in the stations, and further conveying the same to a paper cover pressing station; (e) a step of measuring the thickness D of the book block 100 by using a measuring device integrally provided in the paper cover pressing station; (f) a step of transmitting at least one thickness measuring value to the control unit 4; and (g) a step of correcting the adjustment values of the components and the stations of the adhesive binding machine.

Inventors:
RANDOLF VOIGTLAENDER
Application Number:
JP2015124159A
Publication Date:
January 18, 2016
Filing Date:
June 19, 2015
Export Citation:
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Assignee:
MUELLER MARTINI HOLDING AG
International Classes:
B42C13/00; B42B9/00; B65H37/04
Domestic Patent References:
JPH11334244A1999-12-07
JP4771440B12011-09-14
Foreign References:
EP2377688A22011-10-19
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith